copyright@ semipower electronic technology co., ltd. all rights reserved. d ec . 2016. rev. 2.0 1 /6 SW75N75B absolute maximum ratings symbol parameter value unit v dss drain to source voltage 68 v i d continuous drain current (@t c =25 o c) 75* a continuous drain current (@t c =100 o c) 47* a i dm drain current pulsed (note 1) 300 a v gs gate to source voltage 25 v e as single pulsed avalanche energy (note 2) 208 mj e ar repetitive avalanche energy (note 1) 27 mj dv/dt peak diode recovery dv/dt (note 3) 5 v/ns p d total power dissipation (@t c =25 o c) 89 w derating factor above 25 o c 0.7 w/ o c t stg , t j operating junction temperature & storage temperature - 55 ~ + 150 o c t l maximum lead temperature for soldering purpose, 1/8 from case for 5 seconds. 300 o c thermal characteristics symbol parameter value unit r thj c thermal resistance, junction to case 1.4 o c /w r thja thermal resistance, junction to ambient 53 o c /w *. drain current is limited by junction temperature. 1. gate 2. drain 3. source order codes item sales type marking package packaging 1 sw p 75n75b SW75N75B to - 220 tube n - channel enhanced mode to - 220 mosfet features ? high ruggedness ? low r ds( on ) (t yp 7.6m ? )@v gs =10v ? low gate charge ( typ 76nc) ? improved dv/dt capability ? 100% avalanche tested ? application: synchronous rectification , li battery protect board, inverter general description this power mosfet is produced with advanced technology of samwin. this technology enable the power mosfet to have better characteristics, including fast switching time, low on resistance, low gate charge and especially excellent avalanche characteristics. bv dss : 68v i d : 75a r ds(on) : 7.6 m ? 1 2 3 to - 220 1 2 3
copyright@ semipower electronic technology co., ltd. all rights reserved. d ec . 2016. rev. 2.0 2 /6 SW75N75B electrical characteristic ( t c = 25 o c unless otherwise specified ) symbol parameter test conditions min. typ. max. unit off characteristics bv dss drain to source breakdown voltage v gs =0v, i d =250ua 68 v bv dss / t j breakdown voltage temperature coefficient i d =250ua, referenced to 25 o c 0.06 v/ o c i dss drain to source leakage current v ds =68v, v gs =0v 1 ua v ds =54.4v, t c =125 o c 50 ua i gss gate to source leakage current, forward v gs =25v, v ds =0v 100 na gate to source leakage current, reverse v gs = - 25v, v ds =0v - 100 na on characteristics v gs(th) gate threshold voltage v ds =v gs , i d =250ua 2 4 v r ds(on) drain to source on state resistance v gs =10v, i d =37.5a 7.6 8.4 m ? v gs =10v, i d =75a 7.7 8.5 m ? g fs forward transconductance v ds =5v, i d =37.5a 51 s dynamic characteristics c iss input capacitance v gs =0v, v ds =25v, f=1mhz 4290 pf c oss output capacitance 280 c rss reverse transfer capacitance 278 t d(on) turn on delay time v ds =34v, i d =30a, r g =25?, v gs =10v (note 4,5) 31 ns t r rising time 124 t d(off) turn off delay time 139 t f fall time 101 q g total gate charge v ds =54.4v, v gs =10v, i d =30a (note 4,5) 76 nc q gs gate - source charge 17 q gd gate - drain charge 34 r g gate resistance v ds =0v, scan f mode 0.7 ? source to drain diode ratings characteristics symbol parameter test conditions min. typ. max. unit i s continuous source current integral reverse p - n junction diode in the mosfet 75 a i sm pulsed source current 300 a v sd diode forward voltage drop. i s =75a, v gs =0v 1.4 v t rr reverse recovery time i s =30a, v gs =0v, di f / dt =100a/us 32 ns q rr reverse recovery charge 27 n c . notes 1. repeatitive rating : pulse width limited by junction temperature. 2. l =0.46mh, i as =30a, v dd =50v, r g =25?, starting t j = 25 o c 3. i sd 30a, di/dt = 100a/us, v dd bv dss , staring t j =25 o c 4. pulse test : pulse width 300us, duty cycle 2%. 5. essentially independent of operating temperature.
copyright@ semipower electronic technology co., ltd. all rights reserved. d ec . 2016. rev. 2.0 3 /6 SW75N75B fig. 1. on - state characteristics fig. 3. on - resistance variation vs. drain current and gate voltage fig. 4. on - state current vs. diode forward voltage fig 5. breakdown voltage variation vs. junction temperature fig. 6. on - resistance variation vs. junction temperature fig. 2. t ransfer characteristics
copyright@ semipower electronic technology co., ltd. all rights reserved. d ec . 2016. rev. 2.0 4 /6 SW75N75B fig. 9 . maximum safe operating area fig. 10. transient thermal response curve fig. 8. c apacitance characteristics fig. 7. gate charge characteristics
copyright@ semipower electronic technology co., ltd. all rights reserved. d ec . 2016. rev. 2.0 5 /6 SW75N75B v dd dut v ds r l r gs 10v in 10% v ds v in 90% 10% t d(on) t r t on t d(off) t off t f fig. 12 . switching time test circuit & waveform fig. 13 . unclamped inductive switching test circuit & waveform fig. 11. gate charge test circuit & waveform
copyright@ semipower electronic technology co., ltd. all rights reserved. d ec . 2016. rev. 2.0 6 /6 SW75N75B disclaimer * all the data & curve in this document was tested in xian semipower testing & application cente r. * this product has passed the pct,tc,htrb,htgb,hast,pc and solderdunk reliability testing. * qualification standards can also be found on the web site ( http://www.semipower.com.cn ) * suggestions for improvement are appreciated, please send your suggestions to samwin@samwinsemi.com fig. 14 . peak diode recovery dv/dt test circuit & waveform v dd same type as dut v ds l r g 10v gs i s + - v ds dut *. dv/dt controlled by rg *. is controlled by pulse period v gs (driver) i s (dut) v ds (dut) body diode forward voltage drop v f diode recovery dv/dt i rm di/dt 10v diode reverse current v dd
|
